PEACHTREE CITY, GA – The metaverses offer myriad opportunities not just for users but for developers of computing devices. As that market takes off, what novel innovations in materials and production will be needed for printed circuit designs to meet the requirements for weight, size, and functionality?
Those are the questions Dr. Brian Toleno, manager, Applied Materials at Meta’s Reality Labs, will tackle when he keynotes this year’s PCB West conference. His talk, Augmented and Virtual Reality, the Next Computer Revolution, will describe the current market, use cases, and the technology all around AR/VR, with a focus on the printed circuit board aspects.
At Meta, Dr. Toleno leads a multi-disciplinary team that works on the material challenges in Meta’s consumer electronics hardware. These devices include VR headsets (Quest 2), smart glasses (Ray-Ban Stories), Portal smart screens and other exciting devices that help bring people together.
Dr. Toleno is a leading expert in materials science for electronics applications. Prior to Meta, Dr. Toleno was director of new technology at Microsoft, working on the Hololens and director of global product management for underfills and encapsulants at Henkel. He was also a director of SMTA. He has a doctorate in chemistry from Penn State University and a bachelor of science in chemistry from Ursinus College.
His talk takes place Oct. 5 from 11:00 a.m. to 12:00 p.m. at the Santa Clara (CA) Convention Center as part of “Free Wednesday.”
“Virtual reality is much further along than many people realize,” said Mike Buetow, conference director, PCB West. “It has more daily transactions than the two largest digital currencies combined. Dr. Toleno has a deep knowledge of electronics manufacturing, and I can’t think of a better person to explain the computing requirements from the cloud, the edge and localized devices this future will require.”
The PCB West conference will be held October 4 to 7 at the Santa Clara (CA) Convention Center, featuring classes for every level of experience, from novice to expert.
An exhibition featuring more than 100 leading suppliers to the electronics design and manufacturing industry will be held October 5.
There is no fee to attend Dr. Toleno’s presentation, but advanced registration at pcbwest.com is required.
PRINTED CIRCUIT DESIGN & FAB and CIRCUITS ASSEMBLY magazines are media partners for the event.
About PCB West
PCB West is the leading technical conference and exhibition in North America for electronics design, fabrication, assembly and test engineers. It will take place October 4-7, 2022, at the Santa Clara (CA) Convention Center. The event includes a one-day exhibition on October 5.
PRINTED CIRCUIT DESIGN & FAB and CIRCUITS ASSEMBLY magazines are media partners for the event.
For more information about PCB West, visit pcbwest.com.
About Printed Circuit Engineering Association, Inc.®
Printed Circuit Engineering Association (PCEA)® (pcea.net) is a nonprofit association that promotes printed circuit engineering as a profession and encourages, facilitates, and promotes the exchange of information and integration of new design concepts through communications, seminars, workshops, and professional certification through a network of local and regional PCEA-affiliated groups. PCEA serves the global PCB community through print, digital and online products, as well as live and virtual events. PCEA publishes PRINTED CIRCUIT DESIGN & FAB (pcdandf.com) and CIRCUITS ASSEMBLY (circuitsassembly.com), as well as the PCB UPdate (pcbupdate.com) e-newsletter. PCEA also produces the PRINTED CIRCUIT UNIVERSITY (printedcircuituniversity.com) online training platform, and trade shows and conferences, including PCB East (pcbeast.com), PCB West (pcbwest.com) and the PCB2Day workshop series.
