WILSONVILLE, OR -- Mentor today announced the launch of a consortium to drive new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer IC designs.

The Mentor OSAT (outsourced assembly and test) Alliance program joins the EDA software developer with OSATs to provide fabless companies with design kits, certified tools, and best practices to aid adoption of new packaging solutions that require a tighter link between chip and package design.

Mentor also announced Amkor Technology as its first OSAT Alliance member.

Through the Alliance, members will work with Mentor to create certified design kits to help customers speed IC and advanced package development using Mentor tools.

“Mentor’s customers are pioneering technologies at the heart of IoT, autonomous driving and next-generation wired and wireless networks,” said Joe Sawicki, vice president and general manager of the Design to Silicon Division at Mentor. “Many of these companies are designing ICs that use advanced packaging from OSATs to achieve their design goals. Like the Mentor Foundry Alliance program did for accelerating foundry design kit creation, the Mentor OSAT Alliance program will help our mutual customers use Mentor’s world-class EDA portfolio to more easily implement ICs with advanced packaging technologies.”

Members of the Mentor OSAT Alliance will receive software, training, and reference flow best practices from Mentor, in addition to the opportunity for co-marketing mutual offerings.

“The next generation of IC packaging will require increased heterogeneous die integration, incorporating reduced size, weight, and improved performance and reliability,” said Ron Huemoeller, corporate vice president, research and development at Amkor. “Amkor’s Silicon Wafer Integrated Fan-out Technology (SWIFT™) package technology is designed to provide increased I/O and circuit density within a significantly reduced footprint and profile for single and multi-die applications. Being an integral part of the Mentor OSAT Alliance program will allow us to fast-track PDK development and delivery, and enable our customers to design more efficiently and predictably.”

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