BANNOCKBURN, IL – Fujitsu Network Communications has built a 20-layer complex board manufactured using only an IPC-2581B design file.

The board was one of five built as a beta test of the new electronics data transfer standard.

With the release of IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, design engineers now have a way to organize and convey printed circuit board designs from CAD tools in a single intelligent file to manufacturing for fabrication, assembly and test.

“IPC-2581B uses an intelligent XML schema format that accelerates printed circuit board fabrication, assembly and testing, and enables design data to be transferred between engineering and manufacturing without the need for human interpretation,” said Tsuyoshi Ueshima, senior vice president of development at Fujitsu Network Communications. “This eliminates redundant labor and reduces the opportunity for error, resulting in high-quality products that customers expect.”

Fujitsu, a founding member of the IPC-2581 Consortium, revealed the board at IPC Apex Expo last month.


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