PP 2793 via plugging paste has a glass transition temperature (Tg) of 155°C and a low coefficient of thermal expansion (CTE). Is a solvent-free one-pack system said to permit planar, blister-free filling for buried vias. Comes in cartridges or packs. UL 94 V-0 listed.

Lackwerke Peters, peters.de


Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article