Sarcon EGR30A thermal interface material absorbs a range of unwanted electromagnetic energy.

The tacky, gel-like consistency makes it easy to handle and apply without requiring additional adhesive. When placed on top of a heat source such as an IC chip, the compliant material fills any unwanted air gaps, permitting more efficient transfer of heat to nearby components or heat sinks. Provides absorption effectiveness across a broad frequency spectrum while exhibiting a thermal conductivity of 3.0 W/m°K (ASTM D 2326) and a thermal resistance of 1.65 K-cm2/W at 14.5 PSI. Comes in five sheet thicknesses (0.5, 1.0, 1.5, 2.0 and 2.5mm) up to a maximum dimension of 300mm x 200mm. Also comes in die-cut form to fit almost any application shape. Is suited for environments with operating temperatures that range from -40° to +120°C and exhibits a UL94 flame retardant rating of V-0.

Fujipoly America

https://www.fujipoly.com/usa

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

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