High-purity SD1100P dianhydride powder for polyimide films are for potential use in 5G flexible printed circuit boards, colorless displays and other flexible electronics applications.

This 4,4'-bisphenol A dianhydride powder helps produce high molecular weight PI formulations that can deliver improved balance between thermal and mechanical properties. Reportedly has lower dielectric constant and dissipation factor, reduced water absorption and improved metal adhesion for creating films and varnishes used in copper-clad laminates, coverlays and adhesives. Can reduce color of PI film for colorless glass display replacements.

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