CLTE-MW laminates include lower profile and thinner copper foil options for producing millimeter wave PCB circuit designs.

Very low profile (VLP) ED copper cladding reportedly reduces insertion loss of transmission lines operating at 77GHz by about 20% compared to standard ED copper foil. VLP copper cladding option is available in 9µm, 18µm and 35µm thicknesses. Seven available thickness options are from 3 mils to 10 mils. Are reinforced with spread glass. Feature low z-axis CTE (30ppm/°C) for excellent plated through-hole and component board level reliability. Well suited for millimeter wave applications that have limitations in thickness due to physical or electrical constraints; millimeter wave automotive and industrial radar antennas; 5G millimeter wave base stations and backhaul radios, and phased array radar systems.

Rogers Corp.
rogerscorp.com

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