This 3-D integrated component carrier is based on 3-D-MID (mechatronic integrated device) technology capable of replacing flexible printed circuit boards.

As part of MID process, a customized layout is applied on 3-D injection-molded part. Surface mount components can then be assembled directly on any carrier surface. Connects element between PCB and electronic components such as LEDs, ICs, photodiodes and sensors. Populated component carriers are delivered in tape and reel. Can be processed in automatic assembly systems. Two different sizes are available and can accommodate electronic components of standard size SOIC-8 and smaller. Customer-specific sizes are an option. Components can be mounted at 90° angle to PCB when sensors need to be positioned normal to PCB; this could be useful for LEDs or photodiodes to generate precise light barriers.

Harting Technology Group


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