MacuSpec THF 100 single-step copper through-hole filling process enables improved thermal and structural designs for IC substrates.

Is a copper electroplating process that plates a solid copper-filled through-hole in core PCB layers. Copper structure has higher thermal conductivity than paste without thermal expansion. Process reportedly can fill through-holes in a fraction of the time that would be required by direct current plating. A combination of high-performance chemistry and equipment allow system to fill holes with minimal dimple and little to no need for surface planarization. Allows through-holes in variety of substrates to be filled with void-free copper structures that have excellent physical properties and performance under thermal stresses of assembly and device operation. Single electroplating step creates continuous copper structure inside hole from top to bottom.

MacDermid Alpha Electronics Solutions
MacDermidAlpha.com

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