Sherlock Automated Design Analysis software v.4.2 includes modeling of potting materials, wire bonds, housing elements (such as stiffeners), and BGA solder balls. Can reportedly perform rapid tradeoff analysis, predict failures earlier in the design process, and make changes to mitigate causes of potential product failures in test or in the field.  Extracts information from design files and creates 3D FEA models of semiconductor packaging and electronic hardware in minutes. Wire bonds can be modeled directly. Can add complex housing elements and other mechanical parts directly to the board and model their possible effects.

DfR Solutions, www.dfrsolutions.com

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