-
ENEPIG Corrosion Mechanisms
Different types of nickel corrosion and potential mitigation strategies.
READ MORE... -
The Future is Thin, Flat and Flexible
What’s ahead for antennas, heaters and inks.
READ MORE... -
Royalty Flush
A noted solutions architect offers an audacious plan for AI acceptance. It just might work.
READ MORE... -
Rocking and Rolling at ZIW
The annual user event was tuned into AI, but that’s not the only melody being played.
READ MORE... -
Can Thailand Pad its PCB Gains?
2023 saw only a handful of fabricators gain ground, but SE Asia is primed to boom.
READ MORE...
Homepage Slideshow
ENEPIG Corrosion Mechanisms
Different types of nickel corrosion and potential mitigation strategies.
https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18389-enepig-corrosion-mechanisms
The Future is Thin, Flat and Flexible
What’s ahead for antennas, heaters and inks.
Royalty Flush
A noted solutions architect offers an audacious plan for AI acceptance. It just might work.
https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18390-royalty-flush
Rocking and Rolling at ZIW
The annual user event was tuned into AI, but that’s not the only melody being played.
https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18391-rocking-and-rolling-at-ziw
Can Thailand Pad its PCB Gains?
2023 saw only a handful of fabricators gain ground, but SE Asia is primed to boom.
https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18329-can-thailand-pad-its-pcb-gains
Ansys 17.0 features improvements across the entire workflow, from modeling to post processing. SpaceClaim Direct Modeler speeds time to CAE with improved performance for importing complex models and more tools for faster geometry creation and editing. New industry-specific vertical solutions facilitate OEM-supplier interactions while adhering to such industry standards, such as ARINC 664/653, FACE and AUTOSAR. Chip-package-system design workflow for electronics is more tightly integrated and automated, and now includes across-the-board performance improvements for power integrity, signal integrity and EMI analyses. High performance computing improvements provide 20 to 60X performance gains for package and board simulation. Thermal analysis in now integrated and automated in SIWave.
