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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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Press Releases

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Category: Press Releases

Keysight’s end-to-end portfolio accelerates market introduction of products based on the latest high-speed computing interfaces

Read more: Keysight’s High-Speed Digital Test Solutions Selected by Allion Labs to Validate SerDes* Devices...

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Category: Press Releases

Sunrise, Florida, December 4, 2020 – Nano Dimension Ltd. (Nasdaq: NNDM), a leading Additively Manufactured Electronics (AME)/PE (Printed Electronics) provider, today announced an updated summary for 2020 regarding customers’ upgrades of older DragonFly Pro machines to the next generation 24/7 DragonFly LDM machines.

Read more: Nano Dimension Reports Ten Customers Upgraded their Machines to DragonFly LDM (Lights-out Digital...

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Category: Press Releases

Large 80-unit order for the company’s ESI CapStone system will help a leading flex PCB processor in Greater China address 5G-related processing challenges.

Read more: MKS Sees Strong Sales for its Latest Flexible PCB Laser Processing Solution

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Category: Press Releases

The 15th Electronic Circuits World Convention (ECWC15), International Technical Conference & Virtual Exhibition are unveiled at the same time to offer more opportunities for industry connection and business development

Read more: 2020 International Electronics Circuit Exhibition (Shenzhen) Opens Today with the latest PCB...

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Category: Press Releases

Printed/flexible electronics is a constantly evolving area with extensive scope for innovation. Here, IDTechEx outlines three of the most exciting technological highlights in the sector. These innovations span from technically advanced materials to novel manufacturing methodologies, covering a diverse set of applications that range from OLED displays to wearable healthcare patches.

Read more: Printed and Flexible Electronics: Key Technology Highlights in 2020 from IDTechEx

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Category: Press Releases

High-Density Packaging (HDP) User Group is pleased to announce that Larry Marcanti has been appointed Executive Director for the organization by the HDP Board of Directors.

Read more: HDP User Group Announces the Appointment of Larry Marcanti as Executive Director

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