Features thin core handling for complete automation

With the help of a super thin AT&S PCB substrate, LG Innotek developed the world’s smallest Bluetooth module

The Taiwan International Circuit Board Industry Exhibition (TPCA Show 2020) and the International Assembly and Circuit Board Conference (IMPACT-EMAP 2020) were held on October 21-23. This year, the Taiwan Circuit Board Association, together with leading industry associations such as the Electric Power Association, the International Trade Association, the Optoelectronics Association, and the Laser Association, jointly launched the "Taiwan International Electronic Manufacturing Joint Exhibition" for the first time.

The last decade has seen an explosion in 3D printing, among hobbyists and professional users alike. The ability to prototype – or even, increasingly, industrially produce – almost any component with just a CAD package and a 3D printer has transformed the manufacturing landscape. Although there are drawbacks to the process, including proportionate cost and scalability, recent improvements in 3D printing capabilities meant that pre-Covid-19, commentators predicted a bright future for this technology and the sector had been on a solid upward trajectory for around a decade.