Silicon Valley: Zero Defects International [ZDI] has recently received notice of compliance with and renewed registration for ITAR, the International Traffic in Arms Regulations.

High Density Packaging (HDP) User Group is pleased to announce that Nippon Denkai has become our newest member

CAVE CREEK, ARIZ. (PRWEB) JANUARY 21, 2021

“Nippon Denkai is excited to be a member of the HDP User Group. We look forward to learning from our member partners through the collaborative problem solving approach fostered by the HDP team. By contributing our knowledge in copper foils, we believe that our participation will assist in projects related to printed circuit board processing, reliability, and signal integrity,” said Michael Coll, COO at Denkai America.

Connectivity has always been at the core of Internet of Things (IoT) solutions. Whether tapping a local ethernet connection for Programmable Logic Controller (PLC) monitoring or deploying gateways and backhauling data over a cellular network, connectivity starts the IoT solution journey.

BANNOCKBURN, Ill., USA, January 21, 2021 — IPC's Validation Services Program has awarded an IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements Qualified Manufacturers Listing (QML) to TTM Technologies, Inc.’s facilities in Sterling, Va. and Stafford Springs, Conn. Following initial audits by IPC, the Sterling, Va. facility passed stringent fabricator requirements, while the Stafford Springs, Conn. facility passed designer and assembler requirements, earning both facilities a spot-on IPC’s global network of rigorously vetted, trusted sources.