Simon Fried, Nano Dimension USA President, presenting at two sessions and available for meetings during the event

NESS ZIONA, Israel – Jan. 17, 2018 – Nano Dimension Ltd., a leading additive electronics provider (Nasdaq, TASE: NNDM), will demonstrate its additive manufacturing system for printed electronics, the DragonFly Pro system, at IPC APEX EXPO 2019. The show takes place January 29-31 at the San Diego Convention Center. The solution will be on display in Nano Dimension’s booth #2104.

Read more: Nano Dimension Demonstrates Precision Additive Manufacturing for the Most Demanding Challenges for...

AT&S offers high-performance PCB and packaging technologies for electric/hybrid drives and advanced driver assistance systems

Read more: Innovators for electromobility and automated driving

BERLIN, January 17, 2019: Atotech announced today that it will introduce its latest panel level plating processes and equipment solution for high resolution pattern plating during the NEPCON Japan show, held January 16 to 18, 2019, at Tokyo Big Sight.

Read more: Atotech to present its new series of panel level plating processes and equipment for high...

17 January 2019 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, will be showcasing its latest high reliability PCB materials on booth #417 at APEX 2019 in San Diego from 29-31 January. A key focus at the show will be Ventec's extended ceramic-filled hydrocarbon thermoset material series tec-speed 20.0 which is designed for the world's most demanding high frequency Printed Circuit Board applications. The global Ventec team will be on hand to present the company's unique laminate & prepreg capability across a very wide range of applications and budgets.

Read more: Ventec at APEX 2019 – Delivering on Price, Performance and Availability for high frequency PCB...