SOUTHINGTON, CT – Uyemura has published “MEC from Uyemura: The Roadmap for High Density and Ultra-High Density Circuits.”

This is a concise, online overview of advanced surface treatment products, including copper surface treatments that have produced highest product reliability; adhesion enhancement products for high- frequency PCBs; processes that enhance fine wire pattern accuracy; microetchants and residue removal agents for every application; environmentally-favored black oxide replacements, and more. Many of these processes are available for the first time in North America.

The document can be downloaded here: https://www.uyemura.com/articles/MEC-from-Uyemura-Brochure.pdf 

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