SAN DIEGO, CA – Pre-registration is now open for Chiplet Summit's second annual event on February 6-8 at the Santa Clara Convention Center. Hundreds of registrants and many key exhibitors will be at the premier showcase for chiplet technology. All major chip makers have adopted chiplets as their approach to producing devices at leading-edge nodes.

The event will cover the latest architectures, development platforms and methods, and applications. Expert panels will discuss best choices, likely breakthroughs, optimization, and long-term trends. Pre-conference seminars will focus on chiplet basics, packaging methods, interfaces, design methods, working with foundries, AI in chiplet design, and the Open Chiplet Economy. Other features include a high-powered superpanel on “How Can Chiplets Accelerate Generative AI Applications?”, an expert table session (with beer and pizza), and an annual update of technologies and markets.

Industry-leading keynotes offer designers insight into trends and roadmaps. Speakers represent Applied Materials, Synopsys, Micron, Alphawave Semi, Hyperion Technologies (introducing a new packaging technology with larger packages and a 1000W power budget), and Open Compute Project (OCP). Their focus is on methods for designing processors, coprocessors, communications devices, and graphics and AI chips.

“We now see the full impact of chiplets. They allow designs to include off-the-shelf components as well as drop-ins from older process nodes,” said Chuck Sobey, Summit General Chair. “They are ideal for applications such as AI that demand more processing power, faster response time, and the ability to handle more data. Chiplet Summit will help designers make the right decisions for current projects and future needs.”

Chiplet Summit also features innovative products from industry leaders such as Applied Materials, Synopsys, Alphawave Semi, Open Compute Project, Achronix, Arm, Cadence, and Siemens EDA.

Visit Chiplet Summit:
ChipletSummit.com

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