Fort Worth, Texas – June 2, 2021 – TTI, Inc., a leading specialty distributor of electronic components, is sponsoring a live webinar, “From Selection to Soldering: The Pros and Cons of Connector Types and Assembly,” Thursday, June 10, 2021, at 11:00 a.m. EDT.

Choosing between surface mount, through hole or pin-in-paste connectors and assemblies is one of the first and most critical decisions you make in determining the impact and implications of your printed circuit boards. In this webinar, Neil Moore, Product Manager – EMC and Industrial Products at Harwin, brings his extensive knowledge of circuit board design and production techniques with customer projects from the initial selection stages to the soldering process.

Moore will discuss how the soldering process works with different connector styles, which assembly process to use for your designs and the pros and cons of surface mount, through hole and pin-in-paste assembly types.

For key insights for your next design, register for this webinar today.

• Prev
• Next