(Waterbury, CT USA) – April 1st, 2019 – MacDermid Alpha Electronics Solutions, the world leader in the production of electronic soldering and bonding materials, is participating in the IDTechEx Show taking place on April 10th-11th in Berlin Germany.

MacDermid Alpha is pleased to introduce its portfolio of exciting new products, designed for various segments of the growing and increasingly important Printed Electronics market.  They will be exhibiting these latest electronics materials at Booth #J14.

•    For Flexible Hybrid Electronics (FHE) Applications – MacDermid Alpha will introduce a unique Ultra Low Temperature Solder Paste (ULTS) that permits SMT type assembly on PET circuit boards.  Further, this solder paste enables attachment of heat sensitive components such as displays and batteries.

•    For Printed Electronics Applications – MacDermid Alpha will exhibit its mutually compatible platform of products that include Silver Inks, Carbon Inks and Dielectric Inks.

•    For Formable Electronics (IMSE) – MacDermid Alpha will introduce its mutually compatible portfolio of Silver and Dielectric Inks for IMSE applications for both PC and PET substrates.

“IMSEs represent a truly revolutionary approach to electronics assembly and packaging.  ALPHA® Electronic Materials for IMSE applications are engineered to be mutually compatible and well suited for use with substrates and variety of decorative coatings,” said Rahul Raut, Director of Strategy & Technology Acquisition for MacDermid Alpha Electronics Solutions.  

“The novel ALPHA® Ultra-Low Temperature Solders offer a robust platform for low temperature processing and enables use of PET-based substrates, said Dr. Bawa Singh, EVP of Technology and Corporate Development for MacDermid Alpha Electronics Solutions.”  “Furthermore, ULTS leverages the worldwide SMT infrastructure for Printed Electronics Assembly.”

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