Ghent, Belgium - Rogers Corporation (NYSE:ROG) will be showing its specialty materials for Power Electronics Applications which includes its range of laminated busbar solutions (and capacitor-busbar assemblies), curamik®substrates, 92ML™thermally conductive PCB materials, ARLON® Secure® Thermal Transfer Adhesive, and HeatSORB™phase change material at the upcoming APEC 2019 conference and exhibition (http://ww.apec-conf.org).
APEC, the annual Allied Power Electronics Conference, will be held from March 18 through March 20 at the Anaheim Convention Center in California. Rogers Corporation will be exhibiting at Booth #820.
Visitors to Rogers’ booth will have the chance to learn more about the range of ROLINX®laminated and powder coated busbar solutions as well as ROLINX CapLinkcapacitor-busbar assemblies and their outstanding high current and low inductance capability solutions.
ROLINX laminated busbars offer low inductance, compactness, a customized design and, in combination with capacitors, extremely low inductance and high power density capabilities. These enhanced busbar assemblies enable smaller, lighter electronic designs with higher current handling capabilities in support of a wide range of applications, from automotive electronics to solar-powered and wind-powered systems.
Visitors to the Rogers booth can also learn more about curamiksubstrates designed for high-demand applications. The basis of the substrate is a ceramic isolator to which pure copper is applied. The result is ceramic substrates with high heat conductivity, great heat capacity and heat spreading provided by the thick copper layer. These high performance substrates are well-suited for power electronics applications.
In addition, Rogers will be showcasing the 92ML Seriesthermally conductive PCB materials. These materials, which are available as copper clad laminates, IMS, and prepreg, effectively reduce the operating temperature of PCB-mounted power ICs for improved reliability and optimized performance using no additional materials, saving designers weight and space. The thermal conductivity of the 92ML materials is 2 W/(m.K) in the z-axis and 3.5 W/(m.K) in-plane. The materials feature outstanding mechanical and thermal reliability, with Tg of 160 ⁰C paired with low z-axis CTE of 22 ppm/⁰C, as well as UL MOT of 150 ⁰C. Designing with the 92ML Series PCB materials will help keep circuits cool!
ARLON Secure Thermal Transfer Adhesive, a structural adhesive with exceptional thermal, physical, and electrical properties, will be showcased as well. Ideal for use in applications such as power modules, ARLON Secure thermally conductive adhesive is the solution of choice when long-term reliability is a top concern.
Visitors can also learn how HeatSORB™, a proprietary phase change material (patent pending) addresses thermal management issues by capturing heat and delaying temperature ramps, allowing devices to remain cooler longer.
Become a Member of the Design Support Hub.
Rogers Power Electronics Solutions (PES) brings its more than 40 years of experience together in a handy online resource that is available 24/7. The PES Design Support Hub features complete technical information on ROLINX busbars, capacitor busbar assemblies and curamik ceramic substrates, a library of technical papers on product design and problem solving and helpful videos on products and power distribution topics. Registration for access is quick and free of charge. The Design Support Hub helps design engineers to increase power, manage heat, and ensure the quality and reliability of their devices for optimal new product design (https://www.rogerscorp.com/designhub).
