XcitePI IO Interconnect Model Extraction high-speed analysis software generates chip IO power/ground and signal interconnect models for accurate system-level analysis of high-speed channels and buses. Features unique built-in IO quality assessment capabilities to enable fast checks of IO power/ground robustness and signal electrical performance to identify potential design defects. Creates chip models with high resolution and compact size to ensure accuracy and efficiency. These models can be used in conjunction with SPICE-compatible circuits for system-level simulations. Enables quick assessment of power and ground quality along with signal performance at every IO cell.

Sigrity, www.sigrity.com

Clip-on EMI gaskets with water seals include 248 different shapes. Are for EMI shielding (10khz- 22 Ghz), grounding, earthing, electro static discharge and ATEX. >100 dB (10 KHz - 22 GHz); electrical resistance of 0.004 Ohms/cm²; easy to mount; continuous lengths; high shielding performance; low closure force, and high flexibility.

Holland Shielding Systems, www.hollandshielding.com 

FH39 series FPC ZIF connectors can be mated by utilizing either top or bottom contact points, enhancing product design flexibility.

Read more: Hirose Offers FH39 Series ZIF Connectors

SFGL series of ZIF-terminated FPC connectors come in 4mm pitch and 0.9mm height; back flip-type actuator connector is for use in tablet PCs. VLP series is available with 0.5mm pitch and 0.7mm height. Meet standards for ZIF connectors used in backlight and touchscreen applications; are commonly used in smartphone and mobile phone applications.

FCI, www.fciconnect.com/flex