ScanExpress version 7.7 boundary scan tool suite includes improved constraints handling, support for multi-core devices, and new JTAG Embedded Test support for additional Freescale and Texas Instruments processors.

Read more: Corelis Releases ScanExpress v. 7.7 Boundary Scan Suite

Thercobond thermally-conductive bonding and printed materials, for power electronics and photonics applications, offer thermal conductivity, thermal diffusivity, thermal expansion, dielectric and insulating properties, wettability, and printability.

Read more: Applied Nanotech Reveals Thercobond Bonding Materials

Sarcon 25GR-T2d conformable thermal interface medium is for low and high-volume production applications. The reinforced 0.25mm thick TIM is for tight tolerance die-cut operations. When placed between a heat source and a nearby heat sink, gap filler pad provides a thermal conductivity of 1.5 W/m°K and a thermal resistance as low as 0.33 °Cin²/W. Handles operational temperatures between -40°C and +150°C. Comes in pre-cut sheets up to a max. size of 200mm x 400mm.

Fujipoly America, www.fujipoly.com

The FX version of the ICD Stackup Planner integrates boundary element method 2D field solver technology into impedance planning software. Features several configurations. FX is the base package, supporting up to six layers. FX-Pro supports up to 12 layers, and allows multiple differential pairs per layer. FX-HDI supports an unlimited number of layers; uses customizable dielectric materials library.

In-Circuit Design, www.icd.com.au