Passive air-cooled heat sinks feature improved airside heat transfer performance. Integrate novel vapor chamber technology within a 3D thermal solution, with vapor flow spreading heat both laterally in the base and into planar appendage heat pipe blades. High-density fins are attached to the planar blades to enhance thermal performance. Reportedly feature thermal uniformity and low thermal resistance. Handle heat loads from 250W to 2,000W, depending on model. Built with copper (wall and wick) and aluminum (fins); the working fluid can be water or methanol. Customizable mounting features .

Thermacore, www.thermacore.com

Microfill LVF Via Fill electrolytic copper for enhanced microvia filling is for electrolytic copper plating of high density interconnect (HDI) printed circuit boards (PCB). Reportedly is capable of 10–15μm plating thicknesses, microvia filling, high filling efficiency and reduced copper usage. Improves panel and pattern plating distribution and features thermal reliability.

Dow Chemical Co. www.dow.com

Microfill THF-100 electrolytic copper for through-hole fill of substrate core layers on IC substrate printed circuit boards (PCB).

PE8XX series screen-printed conductive inks for printed electronics are said to provide low resistivity. For use with standard thermal curing techniques and photonic curing equipment. Suitable for use in applications such as membrane switches, RFID, electroluminescent lighting and flexible displays.

DuPont Microcircuit Materials, http://mcm.dupont.com