TerraGreen halogen-free, ultra-low loss, RF/microwave/high-speed material is for power amplifier boards for 4G LTE base stations, internet infrastructure and cloud computing. Has a full offering of cores and prepreg utilizing spread-glass fabric. Dielectric constant (3.00 to 3.45) and dissipation factor (0.0030 to 0.0035) remain stable over a wide range of  frequencies and temperatures. Core thicknesses from 0.002” to 0.018”, 0.020”, 0.030” and 0.060” are available. Is a lead-free assembly material with a short-lamination cycle. Is said to be easy to drill, does not require plasma desmear, and prepreg shelf life is similar to FR-4 materials. Is suitable for high-layer count, high-speed digital, backplanes and is compatible with Isola’s FR-4 materials for hybrid designs.

Isola Group, http://www.isola-group.com/products/terragreen/

TAGS: Laminate, Isola, halogen-free, low loss, RF, microwave, high-speed

Direct Board Interconnect Technology (DBiT) process for terminating lead wires or flexible circuits directly on to a PCB eliminates connectors, while producing a high quality connection. Performs direct connection of wire, component lead, or flex circuit via a crimping system. Requires no soldering. Continuous-feed splicing material process.

Autosplice, autosplice.com

Team Design for OrCAD 2.0 supports a hierarchical design methodology. Assigns functional blocks to different team members for concurrent design.

EDABuilder 3.0 includes 3D STEP model automation; automates the library process flow. Can take advantage of a single data sheet input source for automation and verification between mechanical and electrical models. Has STEP format and schematic symbols, and exports PCB footprints to multiple EDA formats. PCB footprint automation is supported across component families, including all surface mount parts defined in IPC-7351, as well as through-hole parts; all have 3D model generation capabilities. Users enter PCB component dimensioning using IPC-7351 or recommended manufacturer dimensioning. Mechanical dimensioning is entered on the same forms and displayed on the front and side mechanical views. Automatically performs mapping and scaling based on the component type to an embedded 3D template. 3D STEP models can be imported directly into the mechanical design tools. Can be exported directly into Cadence Allegro and OrCAD PCB Editors with origins, offsets, and alignments automatically assigned. Imports symbol and footprint libraries from schematic and PCB editing tools.

EMA Design Automation Inc., www.ema-eda.com