Meteorwave 3000 and Meteorwave 4000 low loss printed circuit board materials come in prepreg and laminate forms. Meteorwave 3000 has a dissipation factor (Df) of 0.0048 at 10GHz and 50% resin content using open resonator testing methodology. Meteorwave 4000 has a Df of 0.0028 at 10GHz and 50% RC. For high-speed transfers and reduced transmission losses. Are said to withstand multiple high temperature lead-free assembly cycles and are for high-layer-count printed circuit board designs. CAF resistant, high Tg, and low z-axis expansion. Meet UL 94V-0 designation, 130°C MOT Rating and IPC-4101/91 and /102 specifications and are RoHS compliant.

Park Electrochemical, www.parkelectro.com

Ultralam 3850HT liquid crystal polymer laminates are for simplified and improved construction of multilayer circuit boards at higher temperatures. Have a melt temperature of +330°C, are adhesiveless and use LCP as the dielectric film. For single-layer and multilayer circuit constructions. For high-speed and high-frequency circuit applications such as in mobile and Internet communications devices and automotive radar systems. Survive multiple solder reflow procedures and increase MLB board processing temperature window. Design dielectric constant (Dk) is 3.14 at 10GHz and +23°C. Dissipation factor (Df) is typically 0.0020 at 10GHz and +23°C. Coefficient of thermal expansion (CTE) (from +30° to +150°C) is typically 18 ppm/°C in x and y dimensions and 200 ppm/°C through z dimension for dimensional stability, predictable MLB scaling, and MLB registration. Thermal conductivity of 0.2 W/m/°K and thermal coefficient of dielectric constant of +24 ppm/°C from -50° to +150°C. Come in panels of double copper-clad laminates of 18 x 12 " (457 x 305mm) and 18 x 24" (457 x 610mm) with ¼-oz. (9-μm) and ½-oz. (18-μm) low-profile electrodeposited (ED) copper. Panels with rolled copper and in custom sizes available upon request.   

Rogers Corp. www.rogerscorp.com.

Conformat conformal drill sheet reportedly shapes itself to various topographies that may be present in a multilayer or rigid-flex PCB. Conforms to low or thin areas on a panel that would have significant burring on the exit side of the panel, reducing rework time and scrap.

LCOA (Laminating Co. of America), www.lcoa.com

Affinity electroless nickel immersion gold (ENIG) final finish is for printed circuit board fabrication. Reportedly provides excellent performance in start-and-stop operation. Delivers stability in phosphorus content; eliminates startup dummy requirements, and operates under a range of bath loading. Has built-in protection against black line nickel. Includes pretreatment chemicals for removal of solder mask residues. Activation eliminates deposition in non-plated through-holes.

MacDermid Electronics Solutions, http://electronics.macdermid.com/