YAVNE, ISRAEL, March 14, 2017 -- ORBOTECH LTD. (ORBK), a leading provider of process innovation technologies, solutions and equipment enabling the transformation of the global electronics manufacturing industry, today announced that a major Japanese electronics manufacturer with worldwide facilities, placed a $5 million order of multiple direct imaging (DI) solutions for solder mask and other solutions.  The Orbotech solutions were adapted to meet the customer's specific manufacturing requirements for smart mobile devices.

Following extensive testing in late 2016 and strong collaboration between Orbotech and its customer, Orbotech received an order for multiple direct imaging solutions to address the technological challenges involved in manufacturing next generation smart mobile devices. Orbotech installed the Paragon™ Ultra delivering superior imaging accuracy and yields for the industry's most complex IC substrates. In addition, the Nuvogo 1000R, Orbotech's large-format DI solution, was also installed enabling consistent high-quality DI for both patterning and solder mask at unmatched speed and yield.

"Our customer had specific demands regarding production standards and specifications that presented unique challenges," stated Mr. Yair Alcobi, President of Orbotech Asia East. "In addition to our systems' high throughput and extreme accuracy, Orbotech succeeded in customizing features to satisfy the specific requirements of a number of advanced applications."

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