SLG free form scoring machine has an automatic tool change system with tool length measurement. Is possible to have different shaped tools in the same program. Board can be scored on both sides simultaneously. Any 2D geometric shape can be scored without turning the board manually. Scoring depth can be set up individually for each side within the program. Exact jump scoring is supported. Bevels can be produced on one side, both sides simultaneously, or inside the printed circuit board. Permits vertical positioning of boards to score thin materials. Panels are located in pins and clamped pneumatically. Smaller PCBs can be arranged on a larger panel and split afterward.

Lenz, http://lenz-gmbh.de/en/products/scoring-machine/series-slg.html

Single Spindle DLG 615-1+1 is for micro-drilling and routing of printed circuit boards. Has separate drill and route spindles selected automatically. Is equipped with two different spindles; both work on PCB and are switched over automatically. Drill spindle is high-speed air-bearing type for drilling micro and medium hole sizes only. Other spindle is a ball-bearing drill and route spindle (10.000 to 60.000 rpm) for drilling large holes and routing. Various drilling spindles are available up to 300,000 rpm.

Lenz, http://lenz-gmbh.de/en/products/drilling-machines/single-spindle-dlg/spindelumschaltung.html

GenClad 280 is a woven fiberglass-reinforced composite material engineered for efficiency in multilayer RF and high-frequency printed circuit boards. Combines a non-polar thermoset resin system with a controlled expansion ceramic filler and a low-loss thermoplastic material. Is halogen-free. Is a low loss ceramic-filled thermoset/thermoplastic hybrid system. Matches PTFE laminate electrical performance.

Arlon, www.arlon-med.com

92ML thermally conductive multilayer epoxy laminate and prepreg is ceramic-filled. Has a thermal conductivity of 2 W/mK for multilayer PWBs for applications requiring thermal management throughout the entire board volume. Reduces hot-spots and dependence on thermal vias and heat-sinks; has glass transition temperature of 170°C for plated through-hole reliability, Pb-free solder application. Has decomposition temperature >350°C, ideally suited for Pb-free solder processing. Has electrical strength of >1000 V/mil for use in high-power handling.

Arlon, www.arlon-med.com