T-Coin (technology of copper coin insert) structure increases the area available for heat conduction for a limited number of through-holes by inserting cylindrical copper (copper coins) into through-holes without leaving gaps, using a method that minimizes pressure loading. Is compatible with copper coin diameters between 3mm and 6mm and printed circuit board thicknesses between 1mm and 2mm. A copper coin insertion apparatus reportedly ensures uniform pressure when inserting copper coins into through-holes. Reportedly achieves a 20-fold improvement in heat dissipation.

OKI Circuit Technology, www.oki.com

Black and TrueWhite laser markable labels are tested to GMW14573 and GM6121M performance requirements for automotive label applications. Can be ablated by a variety of low power lasers, provide flexible, high-temperature alternatives to polyester and acrylic laser markable labels and are durable. Include high-temperature polyimide films, durable cross-linked polymer coatings, low surface energy pressure-sensitive adhesives and liners for handling and die cutting. Can be ablated by most low-power CO₂, YAG, fiber, UV and Vanadate lasers. Adhere to metals, plastics, glass, ceramics and resins.

Polyonics, www.polyonics.com

TC-4525 thermally conductive gap filler provides processability and thermal management in automotive electronics applications. Delivers thermal conductivity of 2.5W/m.K, improved dispensability, and reduced abrasiveness. A soft, compressible, two-part silicone; can be dispensed directly from its original packaging with minimal to no additional process preparation. Suitable for automated dispensing using standard meter mix equipment. Good thixotropic properties; avoids slumping on vertical surfaces during assembly. Maintains vertical stability post-cure. Optional formulation incorporates glass beads to control bond line thickness during assembly. Has fast, controlled cure at room temp.; cure times can be accelerated with heat. Requires no post-cure steps, withstands peak exposure at 200°C. Performs reliably at operating temp. up to 150°C.

Dow Corning, www.dowcorning.com

CR-8000 System Planner has enhanced hierarchical and module-based system design capabilities. Optimizes interconnection of system boards created by multiple users. Design Gateway feature allows constraints design and reuse by multiple team members. Collaborative constraints design and reuse help reportedly reduce design time and improve design efficiency. Constraint information for each functional block is now directly associated with block circuit. Constraints can now be managed at the block level, and constraints associated with reuse circuits are reusable. CR-8000 Design Force and DFM Elements output to IPC-2581B. Interfaces support system design with Simulink and boundary scan with JTAG integration to check original design intent and quality achieved. Information shared concurrently among all engineering disciplines from circuit design to layout.

Zuken, www.zuken.com/cr-8000