New Products

ADS 2016 software improves design productivity and speeds circuit and electromagnetic simulation performance. Features enhanced harmonic balance and circuit envelope simulators to improve speed, convergence and accuracy. Enhanced DC annotation speeds development of even the most complex designs. Electro-Thermal simulator includes Windows and Linux support. Layout and layout verification 

Keysight ADS2016lr

enhancements include manufacturing grid checking and control, improvements to ground nets, faster 3D viewer, improved highlighting and connectivity, and mapping of layout nets to schematic net names, as well as importing .brd files for Momentum electromagnetic (EM) simulation. Adds functionality to benefit OpenAccess-based interoperable and native ADS silicon RFIC design flows. Includes SIPro signal integrity-focused EM simulator for high-complexity PCB applications, and PIPro, a power integrity focused suite of EM simulators for analysis of power delivery networks. Now has direct layout import from Cadence Allegro .BRD file DDR bus simulator support for receiver equalization for DDR4, and a new S-parameter checker/viewer.

Keysight Technologies, www.keysight.com/find/eesof-ads2016.01

MicroLine 5000 is for laser drilling flexible printed circuit boards. UV laser-based drill has a working area of 21" x 24". Comes in two laser power classes and is equipped with precise process monitoring systems, as well as intelligent vision systems for fiducial recognition and alignment. Performs high-speed drilling of blind vias and through-holes and is effective for contour cutting of flex PCBs. Has a laser beam spot size of 20µm. Drills and cuts delicate substrate materials with a minimal heat-affected zone. Configurable for reel-to-reel handling of flex substrates.

LPKF, www.lpkfusa.com

 

Reconfigurable mini probe station model W4.0 x L6.5 is used to test a chip or small printed circuit board that can’t wait for local lab probe station availability. Has footprint of 22" x 9" x 8" and can be used at the desk or a lab. Weighs 9lbs. Is fully manual with 4" x 6.5" test plate with vacuum holes and wide probe holder plates on each positioner with multiple holes for probe mounting. Both positioners can slide back and forth in the X and Y directions and can be moved toward the DUT at the angle. Height positioning is accomplished via digital micrometers, and each positioner can be locked independently. Magnetic plates attach to normal probe mounting holes to allow additional magnetic x-y-z positioners with fine adjustment; probe arms are adjustable in the x, y, z and theta axes.

D-Coax, www.D-COAX.com

 

Contac S4 enables through-hole plating on a laboratory scale, as a result of a cleaning step for microvias. Station can be equipped with up to six baths. Generates through-holes with aspect ratios of up to 1:10, even on multilayer boards with up to eight layers. Tolerance in layer buildup is +/- 2µm. Tin-plating step improves solderability.

LPKF, www.lpkf.com

 

ProtoMat E44 printed circuit board plotter is for mechanical milling and drilling of PCBs out of fully coated base substrates. Features increased spindle speed and a camera for read-in of material position; enables production of double-sided PCBs with micron-level precision and control of the milling channel width. Requires power outlet and dust extraction unit for operation. Is designed for training purposes or occasional use.

LPKF, www.lpkf.com

 

Ansys 17.0Ansys 17.0 features improvements across the entire workflow, from modeling to post processing. SpaceClaim Direct Modeler speeds time to CAE with improved performance for importing complex models and more tools for faster geometry creation and editing. New industry-specific vertical solutions facilitate OEM-supplier interactions while adhering to such industry standards, such as ARINC 664/653, FACE and AUTOSAR. Chip-package-system design workflow for electronics is more tightly integrated and automated, and now includes across-the-board performance improvements for power integrity, signal integrity and EMI analyses. High performance computing improvements provide 20 to 60X performance gains for package and board simulation. Thermal analysis in now integrated and automated in SIWave.

Ansys, ansys-blog.com/introducing-ansys-17/

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