LEEDS, ENGLAND -- Premier Farnell today announced the sale of Cadsoft Computer to a subsidiary of Autodesk. The deal includes Cadsoft's Eagle PCB CAD software tools.
PITTSBURGH – Carnegie Mellon University and Ansys have partnered to boost engineers’ use of simulation to enable opportunities for exploration of materials and designs at the beginning of the development process.
TOKYO – Starting in October in Japan, Fujitsu will offer consulting for the use of artificial intelligence technology at design and manufacturing sites.
GHENT, BELGIUM -- Ucamco seeks input on revisions to the Gerber format to make it more efficient in handling fabrication and assembly panels.
MANCHESTER, NH – EPTAC has joined PowerAmerica to offer IPC Designer Certification to students and faculty of North Carolina State University.
SAN JOSE –– The Multi-Die Integrated Circuit (IC) Design Guide has been updated with the latest background on multi-die integration techniques and technologies.