Design News

BANNOCKBURN, IL – The industry standard that establishes requirements for the design of flexible and rigid-flex printed boards has been updated to its C revision.

Read more: IPC Updates Flex, Rigid-Flex Design Standard

MOUNTAIN VIEW, CA -- Synopsys today unveiled an initiative to accelerate the design of stacked die silicon systems using 3D-IC integration.

Read more: Synopsys to Push Stacked Die Solution

REDWOOD CITY, CA -- Bay Area Circuits has added design services to its printed circuit board fabrication offerings.

Read more: Bay Area Circuits Adds Design Services

WILSONVILLE, OR -- A Mentor Graphics spokesman today said the EDA company "plans to support" the IPC data transfer format.

Read more: Mentor to Support IPC-2581

ATLANTA -- The Valor division of Mentor Graphics will chat about replacing Gerber with ODB++ for data transfer and the launch of a group dedicated to promoting the ODB++ format, UP Media Group announced today.

Read more: Mentor, Mucha to Host Upcoming 'Chats'

EL SEGUNDO, CA -- With the second-generation iPad, Apple has held the line on the bill of materials, maintaining virtually the same costs as the first version of the device, an IHS iSuppli teardown analysis of the product has revealed.

Read more: iPad 2 BoM Costs Static, Teardown Reveals

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