Fab News

BANNOCKBURN, IL – IPC has released IPC-6012D, “Qualification and Performance Specification for Rigid Printed Boards,” a multi-year effort to update the industry standard for bare board acceptance.

Read more: IPC Releases ‘D’ Revision of IPC-6012 Bare Board Spec

BANNOCKBURN, IL – New microvia requirements are at the heart of the latest IPC standard for bare board qualification and performance.

Read more: IPC Updates Rigid PCB Qualification Standard

PHOENIX -- An Arizona jury this week said TUC Technology Corp. owes Isola USA more than $11 million in damages for willfully violating multiple patents for printed circuit board materials.

Read more: Arizona Court Finds for Isola in Latest Patent Battle with TUC

TACOMA, WA – Toray Composites America completed a multimillion dollar expansion project at its production facility here. The opening ceremony is Sept. 25.

Read more: TCA Expands Prepeg Capacity

NEW YORK – The copper-clad laminate market grew 7.1% year-over-year in 2014 to 760 million m2.  Production in China accounted for 68.4% of the global total, says ResearchInChina.

Read more: Laminate Use Up 7% in 2014, Led by China

ARLINGTON, VA – Defense Advanced Research Projects Agency supported researchers have unveiled so-called "dielets" said to be capable of securing the authenticity of electronics components and products.

Read more: DARPA Reveals Program for Anti-Counterfeiting Chips

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