AUSTIN, TX – Fan-out wafer level packaging (FO-WLP) continues to show growth momentum, says TechSearch, with multiple parts found in Samsung’s Galaxy phones and many packages expected in Apple’s next iPhone. Companies are researching large area panel processing as a result of constant pressure to lower cost.

Read more: TechSearch Addresses FO-WLP Panel Processing Challenges in New Report

SUZHOU, CHINA – Seica Electronics has doubled its local technical support team in the first half and expects to expand further in the near future.

Read more: Seica Doubles Tech Support in Suzhou

TORONTO – Firan Technology Group reported record sales in the second quarter of 2016 of $19.8 million, up 5.3% year-over-year.

Read more: FTG Posts Record Q2 Sales Up 5.3%

SAN JOSE, CA  – Jabil has completed the first phase of qualification of Invensas' Bond-Via-Array (BVA) interconnect technology.

Read more: Jabil Qualifies Invensas BVA Interconnect Technology