SUZHOU – Ventec International today announced that the reliability of its polyimide laminates, prepregs and low-flow prepregs has been "conclusively demonstrated" by highly accelerated thermal stress (HATS) testing by two leading PCB manufacturers in Israel.

Read more: Ventec Says Polyimide Reliability Validated by HATS Testing

BRONSCHHOFEN, SWITZERLAND -- Cicor has launched a new technology platform said to enable high density of integrated functions for printed circuit boards, and at a higher throughput than traditional methods.

Read more: Novel Process Enables High-Volume, High-Density Boards, Cicor Says

RONKONKOMA, NY – PCB fabrication equipment vendor Multiline Technology has closed, but its primary European distributor remains open.

Read more: Multiline Technology Closes Doors, Multiline International Still Operating

BRONSCHHOFEN, SWITZERLAND -- A new white paper from Cicor explains ultra high-density interconnect printed circuit boards.

Read more: Cicor Releases Ultra-HDI White Paper