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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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Fab News

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Category: Fab News

NESS ZIONA, ISRAEL – Nano Dimension Technologies is opening an 8,600 sq. ft. production facility for its nano-ink products in the same building as its headquarters here.

Read more: Nano Dimension to Open Ink Production Facility in Israel

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Category: Fab News

SUZHOU – Ventec International has made a multi-million dollar investment to expand B-series insulated metal substrate materials production capacity at its facility in Jiangyin, China.

Read more: Ventec Doubles IMS Material Manufacturing Capacity

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Category: Fab News

PALO ALTO, CA -- PARC, the research arm of Xerox, today announced the advanced technologies to be highlighted at the Aug. 31 NextFlex opening in San Jose.

Read more: Flexible Hybrid Electronics Take Center Stage at NextFlex Opening

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Category: Fab News

TAIPEI -- Zhen Ding expects sales to rebound in the near-term, although it expects flat profit growth for the second half.

Read more: New Plant Should Boost Sales, Zhen Ding Says

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HAVERHILL, MA – DKN Research developed a new copper metalizing process using transparent polyimide films. The new copper laminate will provide manufacturing capabilities using transparent flexible PCBs for traditional manufacturers. It is made from a thin transparent polyimide file plated with a copper layer on both sides.  

Read more: DKN Research Develops Copper Laminate for Flex PCBs

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Category: Fab News

BANNOCKBURN, IL — IPC has announced plans to start development of a standard to cover qualifications and acceptance requirements for press-fit pin technology intended for the automotive and other industries.

Read more: IPC to Develop Press-Fit Pin Standard

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