WASHINGTON — The 90-day moving average worldwide semiconductor sales were $27.7 billion in August, down 3% year-over-year. 

LYON, FRANCE – The volume of devices packaged using flip chip technology will double from 16 million wafers per year in 2014 to 32 million wafers per year in 2020, reaching $25 billion, says Yole Développement.

BANNOCKBURN, IL – North American printed circuit board orders grew 24.1% year-over-year in August, increasing year-to-date order growth to 6.2%. Orders were up 11.3% sequentially, says IPC.

STAMFORD, CT – Worldwide shipments of 3D printers will reach 496,475 units in 2016, up 103% from the predicted 244,533 units in 2015, says Gartner.