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WASHINGTON – The R&D Tax Credit gets new life as part of the Emergency Economic Stabilization Act of 2008. The Federal Research & Development Tax Credit has been extended from December 31, 2007 through December 31, 2009. 
 
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SAN JOSE, CA and SEOUL, KOREA– Tessera Technologies, Inc. has announced that Advanced Wafer Level Packaging Inc. (AWLP) has licensed the company’s full range of SHELLCASE image sensor packaging technologies. AWLP’s new outsourcing packaging company, located in Seoul, Korea, will provide SHELLCASE packaging services to semiconductor manufacturing companies. Tessera believes the licensing agreement “will create a new manufacturing site in a region that is driving the next generation of imager and camera modules.”

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