BANNOCKBURN, IL – The IPC 4-11 plating subcommittee is working on an organic solderability preservative specification to be titled IPC-4555. The testing of various OSP finishes is currently in process.

The completed document is scheduled for publication and distribution at 2009’s IPC Printed Circuits Expo, APEX and the Designers Summit in Las Vegas, NV.

The IPC 4-11 plating subcommittee has previously released the IPC-4552, IPC-4553 and IPC-4554 standards, which set specifications for electroless nickel immersion gold, immersion silver and immersion tin surface finishes (respectively).

The documents are intended to specify methods to obtain the best solderable and reliable surface finishes, and are intended for use by chemical suppliers, PCB fabrication houses, electronic manufacturing services and OEMs.

TAIWAN – Copper clad laminate (CCL) maker Iteq reported total revenue of $44 million (converted from TWD) in May, posting 25.6% year-on-year growth, a record high for 2008.

Industry reports cite the company's increased manufacturing capacity at its Wuxi plant, creation of the JV between between Iteq and Laird for the manufacture of LED heat conductive material, and the start up of production at the company's FCCL plant in Guangzhou, China as the sources of the increased revenue.