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ARLINGTON, VA -- Electronic component orders fell in January for the third consecutive month, according to the monthly index compiled by the Electronic Components Association (ECA). The 12-month average, comparing this year’s results to last year’s, continued a descent that began last summer.

“We might just have to get used to words such as ‘downslide’ for the next several months,” says Bob Willis, ECA president. “Electronic components are the building blocks for all things electronic, so our market is inextricably linked to the economy and spending. Like everyone else, electronic component manufacturers are looking to stay as healthy as possible until better times arrive.”

PALO ALTO – Agilent’s first-quarter revenues fell 16% year-over-year to $1.16 billion. Operating profits were down $69 million.

Semiconductor and board test sales were down 49% from last year to $45 million. Electronic measurement was down 23%. Semiconductor equipment and board test orders were $32 million, down 66% from last year.

WASHINGTON, DC – Intel today announced plans to spend $7 billion over the next two years to build advanced manufacturing facilities in the US. The investment funds deployment of Intel's 32nm manufacturing technology and represents Intel's largest-ever investment for a new manufacturing process.

Intel's investment will be made at existing manufacturing sites in Oregon, Arizona and New Mexico and will support approximately 7,000 high-wage, high-skill jobs at those locations -- part of a total Intel workforce of more than 45,000 in the US. Intel, while generating more than 75% of its sales overseas, carries out roughly 75% of its semiconductor manufacturing in the US, which is also where it spends three-quarters of its investments, the company said

In a speech this morning at the Economic Club of Washington, DC, Intel president and CEO Paul Otellini said, "We're investing in America to keep Intel and our nation at the forefront of innovation. These manufacturing facilities will produce the most advanced computing technology in the world. The chips will become the basic building blocks of the digital world, generating economic returns far beyond our industry."

WASHINGTON -- Starting yesterday, certain electronics products intended for children will be exempted from the Consumer Product Safety Improvement Act lead limit.

Under the CPSIA, the lead content in electronics products intended for children is required to be no greater than 600 parts per million. The Consumer Product Safety Commission has issued an interim rule because the Jan. 15 proposed rules would have been finalized after the Feb. 10 CPSIA compliance deadline.

The CPSC’s interim rule and the Jan. 15 proposed rules clarify that lead contained within electronics parts is inaccessible to children. The CPSC is recognizing that lead in a component part of electronics devices is not accessible to children because the lead is fully enclosed within a component that is itself within the device. Additionally, the CPSC has also exempted the lead content in electronics because it is currently not technologically feasible for certain parts of electronic devices to comply with the CPSIA lead limits of 600 ppm.

The Jan. 15 proposed rules are expected to become a final rule near the end of February 2009. For more information on CPSC regulations and guidance, visit http://www.cpsc.gov/about/cpsia/cpsia.html.