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iNEMI Announces Roadmap World Tour

Published: 11 March 2009
 by Staff
HERNDON, VA – The International Electronics Manufacturing Initiative (iNEMI) plans to release its 2009 Roadmap in April. It is scheduled to discuss its findings at several global industry venues. 
 
The iNEMI Roadmap charts the future manufacturing technology needs of the global electronics industry, identifying important developments needed to maintain a competitive supply chain over the next decade. It serves as a tool to define what is state- of-the-art in the industry, while naming emerging and disruptive technologies.
 
Stops on the global tour include: IPC APEX EXPO, March 31, in Las Vegas; SMTA China East, April 21, in Shanghai; EMPC, June 15-18, in Rimini, Italy; and “Astride the Packaging Roadmap,” April 22, in Cambridge, England. 
 
For additional information about the meetings, visit: www.inemi.org
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