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Unisem Begins Volume Production of Copper Wirebonding Packages

Published: 15 October 2008
 by Staff
KUALA LUMPUR, MALAYSIA – Unisem Group has started volume shipment of packages using copper wirebonding technology.
 
Integrated Device Technology thin shrink small outline packages integrate Unisem’s copper wirebonds for a range of applications, including clock devices for desktops and notebook PCs.
 
“IDT recognizes the traction copper has gained as an interconnect material in semiconductor packaging. The clear advantages of copper – better performance and higher electrical test yields – helped convince us and our customers of the strategic benefits we would receive by using copper wire,” said Anne Katz, vice president of worldwide assembly and test for IDT.
 
By 2009, 30% of Unisem’s wirebonders will be set up for copper, the company says.
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