The awards were presented to individuals who made significant contributions to IPC and industry by lending their time and expertise to committees and standards and programs development.
Special Recognition Award recipients are:
Mark Jankowski, MacDermid, Inc., for his leadership as chairman of the IPC PCB Suppliers Council Steering Committee, Constantin Choueiri, Sigma Circuits Design; Ruth Delker; Javier Jimenez, Dynamic Engineering Services; Scott McCurdy, Freedom CAD Services Inc.; Debbie Nygaard, Honeywell Inc.; and Glenn Wells, Techsville, Inc., for their support of IPC Designers Council activities, Scott Strand, IBM Corporation, for his leadership of the 9-82 Power Conversion Devices Subcommittee and this group’s efforts at generating the upcoming IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries standard, and Gerald Leslie Bogert, Bechtel Plant Machinery Inc. and Nancy Chism, Flextronics, for the work they did to help make Revision B of IPC-7711/7721, Rework, Modification and Repair of Electronic Assemblies a leading-edge document.
Distinguished Committee Leadership Awards went to:
David Bieber, Assembléon, for his leadership as chairman of the SMEMA Statistical Subcommittee, Mark Jankowski, MacDermid, Inc., in recognition of his leadership as chairman of the Process Consumables Statistical Subcommittee, Kelvin Low, SMtech Electronics, for his leadership of the Task Group Asia 5-24CN Assembly and Joining Materials Subcommittee that translated the electronics assembly standards, IPC-J-STD-004, -005 and -006, Edward Kelley, Isola Group SARL, for his leadership of the 3-12c Resin Coated Metal Foil Task Group that developed IPC-4563, Resin Coated Copper Foil for Printed Boards Guideline, Henry Sanftleben, Delphi Electronics and Safety and David Vaughan, Taiyo America Inc., for their leadership of the 5-33e Legend Inks Task Group that developed IPC-4781, Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and or/Marking Inks, and Peggi Blakley, NSWC-Crane Division and Daniel Foster, STI Electronics, for their leadership of the 7-34 Subcommittee that developed Revision B of IPC-7711/7721, Rework, Modification and Repair of Electronic Assemblies.
Distinguished Committee Service Awards were presented to:
John Jephson, Circuit Foil Trading, Inc. and Doug Sober, Kaneka Texas Corporation, for their contributions to the release of IPC-4563, Resin Coated Copper Foil for Printed Boards Guideline, Thomas Farrell, UL; Michael Green, Lockheed Martin Space Systems Company; Douglas Pauls, Rockwell Collins; and Gordon Sullivan, Huntsman Advanced Technology Center, for their contributions to IPC-4781, Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks, Hayao Nakahara, N.T. Information Ltd., for his contributions over many years to the annual World PCB Production and Laminate Market Report as a member of the World Market Consensus Committee, Karen Carpenter, CMTC Associates; Michael Freda, Sun Microsystems Inc.; and Yoshiyuki Tanaka, E.I. du Pont de Nemours and Co., for their contributions to the Executive Market and Technology Forum as members of the Steering Committee, and William Butman, AssemTech Skills Training Corp.; Terry Clitheroe, Solder Technologies; Jennifer Day, Sanmina-SCI; Stephen Fribbins, Fribbins Training Services; Constantino Gonzalez, ACME Training and Consulting; Greg Hurst, BAE Systems; Bernard Icore, Northrop Grumman – ESSS; Leo Lambert, EPTAC Corporation; Brian Langley, OK International; Ximena McKenna, Flextronics; Randy McNutt, Northrop Grumman; James Moffitt, Moffitt Consulting Services; Barry Morris, Advanced Rework Technology; Norma Moss, L-3 Communications; Gregg Owens, Cherry Aerospace; Doug Rogers, Harris Corporation, GCSD; Teresa Rowe, AAI Corporation; Joseph Sherfick, NSWC Crane; Blen Talbot, L-3 Communications; Zenaida Valianu, Celestica International Inc.; Sharon Ventress, U.S. Army Aviation and Missile Command; and Debbie Wade, Advanced Rework Technology, for their contributions to Revision B of IPC-7711/7721, Rework, Modification and Repair of Electronics Assemblies.
