TOKYO – Japan's PCB output has shrunk for 10 consecutive months and continues to fall into double-digit declines, with August representing the third largest decline this year, according to the Japan Electronics Packaging Circuits Association.

Japan’s PCB production dropped by 15.7% year-over-year to 748,000 sq. m., shrinking for the 19th consecutive month. PCB Output in August dropped dropped sharply by 20.2% to JPY45.95 billion ($333.7 million), marking the third-largest drop this year and reaching double digits for the sixth consecutive month – only lower than the 24.7% decrease in April and the 22.6% decrease in July.

In terms of type, the country's rigid PCB output fell 17.2% to 585,000 sq. m. in August, shrinking for the 18th consecutive month; output fell 17.1% to JPY28.35 billion ($198.4 million), the 12th consecutive month of decline.

Flexible PCB production fell 9.3% to 115,000 sq. m., shrinking for the third consecutive month; output fell 8.6% to JPY2.14 billion ($14.3 million), declining for the second consecutive month.

Module substrate output decreased by 11.5% to 48,000 sq. m., declining for the 15th consecutive month; output dropped by 26.5% to JPY15.47 billion ($103.4 million), shrinking for the fifth consecutive month.

From January to August, Japan's PCB production decreased by 14.3% to 6.514 million sq. m. compared with the same period last year, and the output decreased by 16.6% to JPY387.1 billion ($2.6 billion).

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