AUSTIN, TX – The CSP market is forecast to grow at an 11% CAGR from 2014 to 2019, according to TechSearch International.

This growth is attributed to CSP use in mobile products such as smartphones. 

QFN packages are showing particularly strong growth, says the research firm, driven by conversion from other leaded packages, as well as adoption in new applications. Aside from automotive and industrial applications, QFNs are also finding increased use in power devices.

New versions of the package are being introduced, with routable QFNs gaining in popularity as a higher density solution that can support multiple die, says TechSearch.   


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