Printed Circuit Design & Fab Online Magazine - Fab News

Fab News

Details: Written by TEST ADMIN; Category: Fab News; Published: 17 March 2021

ATLANTA – ECIA's chief analyst Dale Ford will present a review of component industry market data and his perspective in a webinar on Mar. 18 at 1:00 pm EST.

Details: Written by TEST ADMIN; Category: Fab News; Published: 11 March 2021

SUNRISE, FL – Nano Dimension reported fourth quarter revenues of nearly $2 million, down 0.3% year-over-year and up 350% sequentially. Changes are attributed to sales of DragonFly LDM systems.

Details: Written by TEST ADMIN; Category: Fab News; Published: 10 March 2021

BANNOCKBURN, IL – In recognition of significant contributions to IPC and the electronics industry, Yusaku Kono of Japan Unix and Jon Vermillion of Ball Aerospace and Technologies were presented with IPC President's Awards.

Details: Written by TEST ADMIN; Category: Fab News; Published: 10 March 2021

BANNOCKBURN, IL – Three IPC volunteers were presented with Dieter Bergman IPC Fellowship awards: Michael Ford, Jan Pedersen, and Peter Tranitz. They will bestow Dieter Bergman Memorial Scholarship awards on the university or college of their choice.

BANNOCKBURN, IL – IPC presented the Peter Sarmanian Corporate Recognition Award to Calumet Electronics and the Stan Plzak Corporate Recognition Award to GM China.

LISLE, IL – Molex has received a US patent for a grid array connector system. The novel connector has conductors from cables directly terminated to a PCB. The conductors can be attached to a support via a welding operation, and pedestals are mounted on the board.