BANNOCKBURN, IL – IPC has released IPC-4202A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry. The revised standard provides data to help determine the capability and compatibility of flexible base dielectric materials in manufacturing flexible printed circuitry and flexible flat cables.
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LAS VEGAS – IPC announced the 2010 Best Industry Posters and the winners of the second annual IPC Academic Poster Competition at Apex Expo.
   
Tied for first place were Christopher Hunt, Ph.D., National Physical Laboratory, for “Solder Joint Reliability from Material Properties,” and David Lee, Ph.D., Johns Hopkins University, for “Comparison of the Electrochemical and Physical Properties of the Nanocrystalline Copper Deposition in the Fabrication of Wiring Boards.”

From twenty–three industry posters presented, the event’s Technical Program Committee selected the winners through a ballot process.

IPC also held an academic poster competition. Attendees voted on the top three posters, with first place going to Pylin Sarobol, Aaron Pedigo, P.Su, J.E. Blendell, and C.A. Handwerker, Sc.D., from Purdue University for “A Defect Phase Diagram for Tin Whisker and Local Film Properties near Whiskers.”

The same team, with Aaron Pedigo as the main author, took second place for “Tin Whisker Growth Related to the Crystallographic Texture of Sn and Sn Alloy Electrodeposits.”

Amendra Koul from Missouri University of Science and Technology won third place for “Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor.”

Ten posters highlighting research being conducted at the college level were featured from Auburn University; Missouri University of Science and Technology; Purdue University; University of California, Irvine, and University of Maryland.