CAVE CREEK, AZ – The High Density Packaging User Group announced the Smooth Copper Signal Integrity project, focused on evaluating the effects of processing smooth copper foil for printed circuit boards and the roughness on all sides of a trace produced when the circuits are fabricated.

The project will evaluate the variation caused by etch chemistry/oxide chemistry and the methods of roughness measurement.

The frequencies of electrical signals in electronic applications have approached the point where the roughness of the copper traces is affecting the quality of the electrical signals and limiting the speed of the system, says the user group. There is a need to understand the issue and methods for reducing the roughness without sacrificing adhesion.

“Many of our member companies are interested in better characterizing the effects of fabrication processes on smooth copper and subsequent copper roughness measurement technology, which has significant impact on system performance at high speed,” said John Davignon HDP user group facilitator.

All interested parties are invited to participate. There will be a kick off WebEx meeting on Nov. 5. For more information, contact This email address is being protected from spambots. You need JavaScript enabled to view it..

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