OSAKA – Panasonic has developed a mass production version of its ALIVH-F (any layer interstitial via hole) resin circuit boards that use polyimide film as a substrate.

This enables the manufacture of thin profile, high-density, light weight flex circuit boards.

This development has further advanced the multilayer resin board ALIVH often used in handheld devices such as smartphones.

By reducing thickness by approximately 30%, weight by 35%, and the inter-layer via hole diameter by 25%, it has been possible to increase the circuit density of the board, Panasonic says. ALIVH-F is expected to also enable higher density component packaging. The any-layer IVH structure employing the same glass-epoxy board material as ALIVH permits high-density packaging of components.

Sample shipments of the newly developed ALIVH-F are scheduled to start in June, with mass production planned for December, the firm says.

松下开发ALIVH - F量产版

大阪 - 松下已经开发了ALIVH-F（下任何层间通孔）树脂电路板，使用聚酰亚胺薄膜作为基板的量产版。这使制造超薄，高密度，重量轻，柔性电路板。
这方面的发展，进一步推进多层树脂板的ALIVH通常用于手持设备，如智能手机。

减少约30％，35％的重量，和25％的层间通孔直径的厚度，它有可能增加电路板密度，松下说。 ALIVH-F的预期，也使高密度组件包装。任何层IVH的结构，采用相同的ALIVH板玻璃环氧树脂材料允许高密度封装组件。

新开发的ALIVH - F样品出货，预定在6月开始批量生产计划十二月，该公司说。

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