Printed Circuit Design & Fab Online Magazine - 2011 IPC Roadmap to Compare Regional Capabilities

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Printed Circuit Design & Fab Magazine

BANNOCKBURN, IL – Several new topics and features have been incorporated into 2011 IPC International Technology Roadmap to provide data and comparisons between technologies and reliability.
The latest Roadmap, which is set to be published next spring, expands the regional analysis and comparisons. The substrate and assembly sections, for example, provide insight into the regional differences in capability between Asia, Europe and North America.

Another addition is the link of emulators to industry standards and specifications. A new section discusses changes needed in industry standards to make them relevant to tomorrow’s needs.

The committee invites anyone interested in joining the final meetings from November through January to contact This email address is being protected from spambots. You need JavaScript enabled to view it..

The roadmap will be unveiled at IPC Apex Expo in April.

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2011 IPC Roadmap to Compare Regional Capabilities

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