SCOTTSDALE, AZ -- An industry research group is launching a project group focusing on optical electronics.

The High Density Packaging User Group International, a nonprofit cooperative research and development organization, says the project aims to alleviate intra-cabinet interconnect bottlenecks envisaged in terabit-scale systems, as data rates are reaching 15 to 25 Gbps per lane, by connecting electronics devices with optical paths. The project is developing optical interconnect architectures that can respond to capacity and energy efficiency needs of future high-speed systems, for example, high-performance computers, servers, routers and switches. Although, the primary focus is on data and telecommunication segments, the aim is to provide a generic technology platform for a  range of applications.

Subgroups also have been launched for devices, waveguides, architecture and standards recommendations.

HDPUG says the project is open to all companies interested in the focus area.

"The members of HDP User Group are working together to understand the benefits and solve the technical hurdles to the implementation of this important technology. A coordinated effort such as this is necessary to quickly bring the full benefits of Optoelectronics into widespread use" noted Marshall Andrews, executive director.

Jack Fisher has been named the project facilitator. He had teamed with Andrews in the 1990s and early 2000s as the CTO and CEO, respectively, of ITRI, a printed circuit board research consortium.

Optoelectronics, which uses light pulses rather than electrical pulses to transmit signals, offers many potential benefits to next generation electronic products, such as higher speed, less interference, and lower power consumption.

Companies such as Huawei Technologies and TTM have signed on to lead the work.

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