Log in / Register
  • Maximizing Yields with Minimal Iterations

    Maximizing Yields with Minimal Iterations

    DfM practices for preventing common fab and assembly defects.
      READ MORE...

  • Clearance and Creepage in PCB Design

    Clearance and Creepage in PCB Design

    An overview of standards and guidelines for high-voltage applications.
      READ MORE...

  • Addressing the Global Talent Shortage

    Addressing the Global Talent Shortage

    Changing dynamics in the workforce are driving the need for an intuitive user experience. Are the tools up to the task?
      READ MORE...

  • So You’re a Designer. Now What?

    So You’re a Designer. Now What?

    PCB designers can have many different career pathways.
      READ MORE...

  • How to Run a Design of Experiments

    How to Run a Design of Experiments

    A review of the six fundamental steps behind scientific process development.
      READ MORE...

Homepage Slideshow
  • Home
  • Editorial
  • News
  • Fab News
  • IPC Standard Updated for Pb-, Halogen-Free Base Materials

IPC Standard Updated for Pb-, Halogen-Free Base Materials

Published: 24 December 2009
 by Staff

BANNOCKBURN, IL -- The newest version of IPC-4101, the base materials standard, adds language on Pb-free and low-halogen laminates.

The latest revision includes 11 new slash sheets -- for a total of 60 -- to accommodate several new flavors of low-halogen materials.

The Pb-free specifications of IPC-4101C have also been expanded from a single measurement for thermal stability -- glass transition temperature (Tg) -- to now include thermal decomposition temperature (Td), time to delamination at 288C (T288) and Z-axis CTE.

Future revisions likely will address microcracking brought on by Pb-free materials and processing that makes boards more brittle.

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article